Controllers, networks and devices
New enhancements help organizations strengthen device trust, improve cyber resilience and detect threats in AI data platforms
Dell Technologies - Dell Technologies introduces new security by design and cyber resilience capabilities to help organizations secure, detect and recover from next-generation threats. The enhancements address emerging risks from quantum computing and AI by hardening device foundations, strengthening cyber resilience when incidents occur and extending threat detection into AI data platforms.
Advantech and FORT Robotics Collaborate to Advance Safe Physical AI
Advantech - Advantech, a global leader in industrial edge computing and AI systems, today announced the expansion of its edge AI portfolio with the upcoming release of the MIC-735 powered by NVIDIA IGX T5000 module. Built on NVIDIA IGX Thor platform, this industrial-grade system is designed to bring real-time physical AI directly to the edge by combining high-speed sensor processing, enterprise-grade reliability, and functional safety.
Dell AI Data Platform with NVIDIA Supercharges Enterprise AI with Breakthrough Data Orchestration and Storage Innovations
Dell Technologies - Dell Technologies announces Dell AI Data Platform with NVIDIA advancements that help enterprises discover and activate enterprise data while delivering extreme storage performance to power AI applications and autonomous AI agents.
Siemens delivers verified AI-driven cybersecurity solution for Industrial 5G with Palo Alto Networks
Siemens - Today at Mobile World Congress 2026, Siemens announced a verified cybersecurity solution for industrial private 5G Networks in collaboration with Palo Alto Networks. The solution combines Siemens' Private 5G infrastructure with Palo Alto Networks' Next-Generation Firewall (NGFW), specifically optimized for AI, extensively tested to verify high availability, network resilience, and uninterrupted operations.
Ericsson and Intel collaborate to accelerate the path to commercial AI-native 6G
Intel - Ericsson and Intel are pooling their next-generation technology leadership to help accelerate ecosystem readiness for seamless transition to AI-native 6G deployments and use cases.
Rohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026
Rohde & Schwarz - Embedded systems are fundamental to modern electronics, encompassing everything from power input and control PCBs to motors, sensors and user interfaces. Each of these comes with its own testing needs to guarantee optimal performance, reliability and a fast market release of the final product. At embedded world 2026, Rohde & Schwarz will highlight its comprehensive portfolio of advanced test solutions, addressing these critical needs.
Electromagnetic Compatibility of Equipment for Industrial Processes and Laboratories
Industrial Productivity - NAMUR has published an updated version of its recommendation NE021 which covers "Electromagnetic Compatibility of Equipment for Industrial Processes and Laboratories " The paper defines practical requirements for determining the electromagnetic immunity of equipment used in automation and laboratory control systems in the process industry.
Unified Ethernet Standard Unlocks New Opportunities for Industrial Digitalization in Automation Industry
FieldComm Group - The first industrial applications of the jointly developed Ethernet-APL technology by the Standard Development Organizations (SDO) FieldComm Group, ODVA, OPC Foundation, and PI (PROFIBUS & PROFINET International) are already in successful operation in process automation applications worldwide. Now, another significant milestone has been reached.
LAPP introduces its first UNITRONIC ACCESS remote I/O devices
LAPP - With the UNITRONIC ACCESS product range, LAPP is launching its own remote I/O devices for the first time. They expand the existing Industrial Communication offering of the global market leader for integrated solutions and brand products in the field of cable and connection technology and offer new possibilities for decentralised sensor-actuator communication.
Phoenix Contact is setting a new standard for safe automation in industrial process heating
Phoenix Contact - The PLCnext Technology ecosystem from Phoenix Contact now satisfies globally applicable standards such as DIN EN ISO 13577-2/4 and NFPA 85, 86, 87 for industrial process heating. With this development, the company is positioning itself in both the European and North American markets as a provider of functional and data security automation solutions for furnaces and incinerators.
Analog Devices Launches ADI Power Studio and New Web-Based Tools
Analog Devices - Analog Devices, a global semiconductor leader, today announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella: ADI Power Studio Planner and ADI Power Studio Designer.
Memor 17 HC mobile computer approved for use with Epic Rover
Datalogic - Datalogic MemorTM 17 Healthcare mobile computer has been officially approved by Epic for use with its Rover clinical mobile application. System integrators, resellers, and hospital IT departments now have access to a complete package for clinical applications: Epic Rover plus a healthcare-specific, high-performance mobile computer.
Virtual PLCnext Control: A software-based controller for the industrial future
Phoenix Contact - With Virtual PLCnext Control, Phoenix Contact is launching a software-based controller solution that enables flexible automation functions in virtualized IT environments. The solution is fully integrated into the PLCnext Technology ecosystem and opens up new possibilities for state-of-the-art, scalable, and resource-saving automation concepts without any physical controller hardware.
The two leading Single Pair Ethernet networks join forces for the future of industrial communication
SPE Industrial Partner Network - After nearly six years of successful but separate work, the two major networks promoting Single Pair Ethernet (SPE) technology are joining forces. The SPE Industrial Partner Network e.V. and the Single Pair Ethernet System Alliance e.V., consisting of numerous well-known industrial companies, have been committed to the dissemination and further development of SPE since their inception.
High-Performance 5G Smartphone for Zone 2/22 and Div. 2
Pepperl+Fuchs - Pepperl+Fuchs is expanding its portfolio with the Smart-Ex 203—an industrial-grade 5G smartphone specially designed for use in Zone 2/22 and Div. 2 hazardous areas.1 Its proven Smart-Ex user interface, along with innovative features and extensions, makes it a valuable tool in both industrial and hazardous environments.
SIG300 IO-Link Master: The versatile door opener for intelligent automation
SICK - The networked factory: IO-Link as a global standard for smart sensor integration opens up a wide range of possibilities for customers in automation. And this is exactly where SICK comes in. The new SIG300 IO-Link Master from SICK is setting the standard in terms of flexibility, connectivity and user-friendliness. This makes it a crucial component for efficient automation tasks.
Future-proof PC performance
B&R - As manufacturers accelerate their digital transformation, the demands placed on industrial PCs are rising fast. From real-time data processing and AI workloads to preparing for evolving cybersecurity requirements, the pressure is on to combine computing power with long-term system adaptability. The new Automation PC 3200 delivers exactly that.
COMs just got even cooler
Congatec - Congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025. The new cooling solution uses acetone as a working fluid in the heat pipes instead of water. This prevents the thermal transfer medium from freezing at extreme sub-zero temperatures and prevents damage to the cooling solution, the module, and the entire system design. The new cooling solution is also insensitive to mechanical stresses such as shock and vibration.
TI introduces the world's smallest microcontroller
Texas Instruments - Texas Instruments (TI) today introduced the world's smallest MCU, expanding its comprehensive Arm Cortex-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
More AI and graphics performance for low-power SMARC modules
Congatec - Congatec – a leading provider of embedded and edge computing technology – is updating its conga-SA8 SMARC modules: The low-power Computer-on-Modules (COMs) are now available with the latest Intel Core 3 processor generation. This new CPU technology delivers a significant performance boost, making the energy-efficient, credit-card-sized SMARC modules ideal for performance-hungry edge applications and low-power system consolidation.
